| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of obtaining a satisfactory spacer shape and film thickness with an exposure energy of 1,500 J/m<SP>2</SP>or smaller. <P>SOLUTION: The photosensitive resin composition comprises (A) a copolymer of (a1) an ethylenically unsaturated carboxylic acid and/or an ethylenically unsaturated carboxylic acid anhydride and (a2) another ethylenically unsaturated compound, (B) a polymerizable compound, having an ethylenically unsaturated bond, (C) a photopolymerization initiator and (D) a polyfunctional thiol compound structural represented by Formula (1), wherein R<SB>1</SB>is a methylene group or a 2-20C alkylene group; R<SB>2</SB>is a methylene group or a 2-6C linear or branched alkylene group; and m represents an integer of 1-20. <P>COPYRIGHT: (C)2008,JPO&INPIT |
