| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink and a mounting structure of the heat sink for improving working efficiency for replacement of electronic components mounted on a circuit board. SOLUTION: A first heat sink 100 and a second heat sink 200 mounted at the internal side of the first heat sink 100 are mounted on a circuit board 300 with at least a part thereof provided opposed with each other. Therefore, when a transistor 210 is mounted to or removed from the second heat sink 200, working efficiency in replacement of electronic component can be improved by inserting a tool 400 used for mounting and/or removing the transistor 210 into a cutaway part 10 for working or into a working hole 20 in the first heat sink 100 without removal of the first heat sink 100 or the second heat sink 200. COPYRIGHT: (C)2008,JPO&INPIT
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