发明名称 HERMETIC SEALS FOR MICRO-ELECTROMECHANICAL SYSTEM DEVICES
摘要 The invention is directed to a hermetically sealed device and a method for making such device. The device includes optical, micro electromechanical, electronic and opto electronic devices, having a substrate with one or a plurality of optical, opto electronic, electronic or micro electromechanical ("MEMS") elements either singly or in combination that are located on a substrate; a covering having a top part and an extension extending a distance from the top part from the top part, an adhesive that is used to bond the extension portion of the covering to the substrate; and a sealing agent for hermetically sealing the area where the covering extension is bonded to the substrate. In the method of the invention the sealing agent is applied using atomic layer deposition techniques.
申请公布号 KR20080028984(A) 申请公布日期 2008.04.02
申请号 KR20087002538 申请日期 2006.06.14
申请人 CORNING INCORPORATED 发明人 OUYANG MIKE XU
分类号 H01L21/00;H01L23/02 主分类号 H01L21/00
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