Wafer with semiconductor devices and method of manufacturing the same

摘要

It is an object of the invention to improve wafer level packaging processes, in particular so as to enable for reduced bond pad or terminal pitches. For that purpose, a method for fabricating a wafer substrate for semiconductor circuits is provided, whereby
-etch pits are introduced into a wafer having a first side and an opposite second side, and
-conducting material is deposited into the etch pits, so that blind conducting channels are formed which extend from the first side of the wafer into the wafer substrate, and whereby the blind conducting channels are formed prior to fabricating or finishing semiconductor circuits on the first side of the wafer.