| 发明名称 |
Tungsten metal removing solution and method for removing tungsten metal by use thereof |
| 摘要 |
A removing solution for removing tungsten metal which causes a film formation on a semiconductor substrate or adheres to it, wherein orthoperiodic acid and water are contained.
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| 申请公布号 |
US7351354(B2) |
申请公布日期 |
2008.04.01 |
| 申请号 |
US20040001684 |
申请日期 |
2004.12.01 |
| 申请人 |
KANTO KAGAKU KABUSHIKI KAISHA |
发明人 |
SHIMIZU TOSHIKAZU;WATANABE KAORI;AOKI HIDEMITSU |
| 分类号 |
C23F1/30;H01L21/302;C09K13/08;C11D7/18;C23F1/02;C23F1/16;C23F1/26;H01L21/304;H01L21/306;H01L21/308;H01L21/3213;H01L21/44;H01L21/461 |
主分类号 |
C23F1/30 |
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