CIRCUIT SUBSTRATE FOR PREVENTING WARPAGE AND METHOD OF FABRICATING THE SAME

摘要

A circuit board for preventing warpage and a method of fabricating the same are provided to reduce disconnection between a semiconductor chip package and the circuit board by reducing the warpage of the circuit board or the semiconductor chip package. A circuit board(100) includes a substrate and a warpage preventing pattern(P). The warpage preventing pattern is arranged on the substrate and includes a first pattern(P1) and a second pattern(P2). The first pattern is formed on a first corner of the substrate and the second pattern is formed on a second corner thereof. The first corner and the second corner are adjacent to each other. An entire orientation of the first pattern is different from the second pattern. The first pattern and the second pattern are disconnected. The substrate includes a multi layered printed circuit board and the first pattern and the second pattern are arranged on different layers in the PCB.