IMPROVEMENTS IN GROUNDING AND THERMAL DISSIPATION FOR INTEGRATED CIRCUIT PACKAGES

摘要

In assembling a typical microelectronic chip package for which grounding and thermal dissipation is desired, when attempting to simultaneously attach a cover to two different surfaces with two different adhesives, difficulties are typically encountered. This invention provides for a method and electronic package to overcome these difficulties. A cover has an opening which is aligned with a contact on the substrate connected to ground potential. The cover is connected to the electronic device and the ground contact.