| 摘要 |
An improved structure of circuit board, according to the present invention, involves sealing a conductive passageway on a circuit board by use of a spacer disposed in a solder paste. A welding pad is disposed on the conductive passageway so that an electrical terminal is capable of being soldered into the conductive passageway directly. The improved structure of circuit board is capable of stopping the solder paste from entering into the conductive passageway, thus shortening the electrical wiring pathway between the electrical terminal and the circuit board effectively, so as to improve the electrical conductivity between the electrical terminal and the printed circuit board.
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