发明名称 WOOD FLOORING WITH CARBONIZED SOLID WOOD USING SYMMETRIC STRUCTURE AND PROCESS FOR PREPARING THE SAME
摘要 A wood flooring material having a symmetric structure using heat treated wood is provided to improve dimensional stability into comparison with the existing wood floor by using heat treated wood for an upper layer and a lower layer and having excellent variability against to water and heat, to prevent distortion caused by heat and water by finishing up an upper layer and a lower layer with same materials, to be suitable for the ondol culture of Korea by endowing stability of a symmetric structure, and to heighten a sensitive image with high-quality wood color with heat treatment. A wood flooring material having a symmetric structure using heat treated wood comprises a surface treatment layer(10), a heat treated wood layer(20), a base material layer(30) and a heat treated wood layer from the upper part. The surface treatment layer is composed of an ultraviolet curable or thermal curable surface treatment layer, the heat treated wood layer is made of a veneer board having a thickness of 2mm or more treated with heat at high temperature ranging from 150 to 230‹C to guide dimensional stabilization, and the base material layer is made of a wood-based board such as raw wood, water-resistant plywood, MDF, HDF, a particle board, a resin-wood powder composite board, etc. A manufacturing method of a wood flooring material having a symmetric structure using heat treated wood comprises the steps of unifying a heat treated wood layer, a base material layer and a heat treated wood layer in a symmetric structure by compression and forming a surface treatment layer from the upper part, and then cutting out in tongue and groove shapes.
申请公布号 KR20080028015(A) 申请公布日期 2008.03.31
申请号 KR20060093242 申请日期 2006.09.26
申请人 LG CHEM. LTD. 发明人 KANG, SEOG GOO;KIM, JEE WOONG;LEE, SUNG GYU
分类号 E04F15/04;E04F15/10 主分类号 E04F15/04
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