| 发明名称 |
APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR WAFER WITH REDUCED DELAMINATION AND PEELING |
| 摘要 |
<p>APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR WAFER WITH REDUCED DELAMINATION AND PEELING</p> |
| 申请公布号 |
SG140457(A1) |
申请公布日期 |
2008.03.28 |
| 申请号 |
SG20040018859 |
申请日期 |
2004.03.26 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD |
发明人 |
SU CHAO-YUAN;TSAO PEI-HAW;LEE HSIN-HUI;HUANG CHENDER;HOU SHANG-YUNG;JENG SHIN-PUU;HU CHENMING;TSAI HAO-YI |
| 分类号 |
H01L21/301;H01L23/544;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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