| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a temperature rise in a coil in an inductance component having the coil, a module device using the same, and an electronic apparatus. <P>SOLUTION: In order to achieve this purpose, the present invention is provided with closed-circuit shaped magnetic cores 4 and 5 having a leg 4A and a coil 7 built in the leg 4A, and has such a structure that the coil 7 is adherently provided with a heat dissipating member 9. By such a structure, heat generated by the coil 7 can be efficiently transmitted to the heat dissipating member 9 without interposing the magnetic core 4 between the coil 7 and the heat dissipating member 9. As a result, a temperature rise in the coil 7 can be largely reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
