| 发明名称 |
GRINDING PAD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding pad which prevents abrasive grains and grinding chips from clogging the interior of each bubble and a groove, and is hardly decreased in grinding speed even after long-time continuous use, and also to provide a method of manufacturing a semiconductor device using the grinding pad. <P>SOLUTION: The grinding pad 1 has a grinding layer formed of a polyurethane resin foam which contains 0.01 to 25 wt.% of particulates formed of a polyurethane resin and having a mean particle size of 0.1 to 100 μm. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2008068333(A) |
申请公布日期 |
2008.03.27 |
| 申请号 |
JP20060247007 |
申请日期 |
2006.09.12 |
| 申请人 |
TOYO TIRE & RUBBER CO LTD |
发明人 |
DOURA MASATO;HIROSE JUNJI |
| 分类号 |
B24B37/20;B24B37/24;B29B17/00;B29B17/04;C08G18/65;C08G101/00;H01L21/304 |
主分类号 |
B24B37/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
