| 摘要 |
<p>The method involves processing of the front side (3) of the substrate (2), before applying the optical layers (5) in a processing step. The substrate front side is provided with multiple optical layers for forming the reflecting surface (4). The front side has a required accuracy, and an electrically conducting path (7) is applied outside the optical area of use (A) on the front side of the substrate in another processing step. The treatment of the front side of the substrate is carried out at the area adjacent to the conducting path for correcting the change in precision of shape. Independent claims ara also included for the following: (1) a mirror assembly for an extreme ultraviolet projections objective or a illuminating system for the semiconductor lithography, particularly for an extreme ultraviolet lithography, for the reflection of electromagnetic radiation for the production of semiconductor components (2) a projection illumination system for the semiconductor lithography, particularly for the extreme ultraviolet lithography, for the production of semiconductor components.</p> |
