| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photoresist solvent for enabling high speed application in slit coating without lowering a solid-contained content, and also to provide a photoresist composition for enabling the high speed application by the slit coating. <P>SOLUTION: In the photoresist solvent used for the photoresist composition applied on a substrate by a slit coating method, 10 wt.% or more by regarding the weight of the solvent as a reference is low-viscosity solvent of 1.1 cp or less of viscosity at a temperature of 20°C. The photoresist composition containing the above solvent, an alkali-soluble resin, and a photosensitive substance is provided. <P>COPYRIGHT: (C)2008,JPO&INPIT |
