| 摘要 |
Provided are highly reliable, high density stacked semiconductor packages including a plurality of semiconductor chips and a method of manufacturing the stacked semiconductor package. An embodiment of the stacked semiconductor package includes upper and lower semiconductor packages which are sequentially stacked. The upper and lower semiconductor packages include inner leads connected to semiconductor chips. The upper semiconductor package may further include outer leads connected to the inner leads of the upper semiconductor package and that extend outside an encapsulant to be electrically connected to the inner leads of the lower semiconductor package.
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