| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which can reduce its manufacturing cost and is constituted of one or more integrated circuit chips. <P>SOLUTION: The semiconductor integrated circuit device comprises a processor chip 1, external pads 2 provided on the processor chip 1 and connected to external terminals, and function-expanding pads 3 provided on the processor chip 1 and to be connected to an SRAM chip to expand the function of the processor chip 1. <P>COPYRIGHT: (C)2008,JPO&INPIT |
