发明名称 |
METHOD AND APPARATUS FOR SEMICONDUCTOR PROCESSING |
摘要 |
A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
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申请公布号 |
US2008073031(A1) |
申请公布日期 |
2008.03.27 |
申请号 |
US20070929230 |
申请日期 |
2007.10.30 |
申请人 |
PRICE J B;KELLER JED;DULMAGE LAURENCE;CHENG DAVID |
发明人 |
PRICE J.B.;KELLER JED;DULMAGE LAURENCE;CHENG DAVID |
分类号 |
H01L21/67;C23F1/00;H01L;H01L21/00;H01L21/677 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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