发明名称 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
摘要 |
A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.
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申请公布号 |
US2008073783(A1) |
申请公布日期 |
2008.03.27 |
申请号 |
US20070980126 |
申请日期 |
2007.10.30 |
申请人 |
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发明人 |
MATSUSHIMA FUMIAKI;OTA TSUTOMU;MAKABE AKIRA |
分类号 |
H01L23/488;H01L21/60;H01L23/485 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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