| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a stacked ceramic circuit board simply manufactured and having cavities on both sides enabling the high density wiring of conductors and the high density packaging of electronic parts, and also to provide a method for manufacturing the same. <P>SOLUTION: The stacked ceramic circuit board includes a stacked ceramic circuit board 10 having a plurality of ceramic layers 1a-1f stacked via inner wiring conductors 3 between the layers, and having cavities 2a, 2f having different concave shapes on one main surface and the other main surface facing the one main surface, and also includes electronic parts 5a, 5f packaged in the cavities 2a, 2f. In the stacked ceramic circuit board 10, one main surface cavity 2a is positioned in the formation area of the other main surface cavity 2f when viewed transparently from above, and formed back to back with the other main surface cavity 2f via an intermediate laminated body 10b, and thereby the high electronic parts are packaged at high density in the stacked ceramic circuit board simply manufactured. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
