| 摘要 |
A backlight module is composed of a light module, a heat dissipation plate, and heat pipes, wherein the heat dissipation plate is embedded with one or more than one cavity which is corresponding to a point of light source, and the cavities are installed with the heat pipes. A space between the heat pipe and the cavity is emplaced with a solder paste which is heated to connect the heat pipe and the cavity. Next, the heat pipes and the heat dissipation plate are processed with a CNC (Computer Numerical Control) machine, such that the heat pipes and the heat dissipation plate can form into a complete plane, thereby enabling the backlight module to effectively achieve effects of heat transmission, temperature homogenization, and heat dissipation, and a problem of chromatic aberration created by the light module to be effectively prevented.
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