发明名称 |
Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same |
摘要 |
The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which comprises the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) a naphthalocyanine colorant. The epoxy resin composition of the invention transmits visible rays and shields near infrared rays while retaining properties inherent in the epoxy resin. |
申请公布号 |
EP1903605(A1) |
申请公布日期 |
2008.03.26 |
申请号 |
EP20070018230 |
申请日期 |
2007.09.17 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
ITO, HISATAKA;OTA, SHINYA;FUKE, KAZUHIRO;UENISHI, SHINJIRO |
分类号 |
H01L23/29;C08K5/56;C08L63/00 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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