| 摘要 |
An iPVD system is programmed to deposit uniform material, such as a metallic material, into high aspect ratio nano-sized features on semiconductor substrates using a process that enhances the feature filling compared to the field deposition, while maximizing the size of the grain features in the deposited material opening at the top of the feature during the process. Plural sequential dry filling plasma processes are used with backside gas pressure varied to control substrate temperature.
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