发明名称 |
Method of mounting memory device on PCB for memory module |
摘要 |
A memory module and a method of mounting memory devices on a PCB to form the memory module substantially reduce unnecessary routing space and improve signal attenuation characteristics. In the method of mounting and sequentially connecting at least two memory devices on a printed circuit board (PCB) having an axis of elongation to form a memory module, at least one of the memory devices is mounted on at least one face of the PCB so that a base line along an longitudinal axis of the at least one memory device lies at an acute angle with respect to the axis of elongation of the PCB.
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申请公布号 |
US7348219(B2) |
申请公布日期 |
2008.03.25 |
申请号 |
US20050301142 |
申请日期 |
2005.12.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM DO-HYUNG;KOO CHANG-WOO;LEE JUNG-JOON;KO KI-HYUN |
分类号 |
H01L21/50;H05K7/00 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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