发明名称 Method of mounting memory device on PCB for memory module
摘要 A memory module and a method of mounting memory devices on a PCB to form the memory module substantially reduce unnecessary routing space and improve signal attenuation characteristics. In the method of mounting and sequentially connecting at least two memory devices on a printed circuit board (PCB) having an axis of elongation to form a memory module, at least one of the memory devices is mounted on at least one face of the PCB so that a base line along an longitudinal axis of the at least one memory device lies at an acute angle with respect to the axis of elongation of the PCB.
申请公布号 US7348219(B2) 申请公布日期 2008.03.25
申请号 US20050301142 申请日期 2005.12.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM DO-HYUNG;KOO CHANG-WOO;LEE JUNG-JOON;KO KI-HYUN
分类号 H01L21/50;H05K7/00 主分类号 H01L21/50
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