| 摘要 |
A method and an apparatus for controlling the temperature of an objective temperature controlling device, and a system for processing high and low temperatures are provided to enhance the throughput of inspection by using cooling liquid remaining in a wafer chuck without exchange. A method and an apparatus for controlling the temperature includes a pressuring unit(113) and a heating unit(115), and a heat exchanging unit. The pressuring unit increases a boiling point by pressing liquid for temperature control. The heating unit increases the liquid for temperature control up to a temperature more than the boiling point at a normal pressure. The heat exchanging unit exchanges heat between the liquid for temperature control, which is increased up to the temperature more than the boiling point under a normal pressure, and an objective temperature controlling device.
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