| 摘要 |
<P>PROBLEM TO BE SOLVED: To arrange a bonding pad on a semiconductor chip effectively, while maintaining the connection strength of the bonding pad. <P>SOLUTION: The semiconductor device includes two or more bonding pads 11, made up of a bonding unit 11a formed on a semiconductor chip and each as an electrode for bonding of an external connection wire or a bump, and a projection unit 11b formed in a projected state from the bonding unit 11a to the inner part of the face and having a probe contact unit, to which a testing probe is made to contact. In the projection unit 11b, a first center line 1, which extends to a side of the bonding unit 11a, at the tip of the projection unit 11b is dislocated in formation from a second center line 2 of the bonding unit 11a. <P>COPYRIGHT: (C)2008,JPO&INPIT |
