| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device, a polishing pad, and a polishing method, which polish a semiconductor substrate while discharging slurry used to polish the semiconductor substrate in a satisfactory condition by a CMP process. <P>SOLUTION: The polishing device is provided with: the disc-like polishing pad 30 constituted by arranging a plurality of grooves 32 on its surface; a rotatable polishing table provided with the polishing pad on it; a holding mechanism provided above the polishing pad and having a function for pressing the substrate against the polishing pad while holding the substrate to rotate the substrate; and a feeding mechanism for feeding abrasive onto an upper face of the polishing pad. In this polishing pad, depth of the plurality of grooves is increased as approaching an outer fringe from the center of the polishing pad, and spaces that the plurality of grooves have respectively are mutually connected. <P>COPYRIGHT: (C)2008,JPO&INPIT |
