| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency unit for which the removal operation of a cover is facilitated. SOLUTION: In a high-frequency unit, even if a cover 4 is formed of hard-to-bend materials according to the existence of slit sections 6a and 7a, formed on the side face board of a cover 4 and a bending inducing section 9 formed on the upper face board 5, the side face boards 6 and 7 or the upper face board 5 are formed so as to be bent easily; and solder 10 is fused in part; and the bending operation of the cover 4 at that place is repeated so that the cover 4 can be removed. For simplifying the removal operation of the cover 4, the solder is fused in part so that it is possible to reduce the influence of heat on electronic components, and to conduct high-accuracy failure analyses, without impairing the performance of the electronic components. COPYRIGHT: (C)2008,JPO&INPIT
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