| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electric connection method using such a stud bump that can ensure enough clearance between an antenna circuit and an IC chip formed in a noncontact IC medium substrate and has high adhesion with a peripheral sealing resin. <P>SOLUTION: A stud bump 13 is formed by a gold wire, and it is heated/pressurized for bonding, so as to electrically connect an electrode 19 provided in a terminal region of an antenna circuit 18 with the electric contact 12 of an IC chip 11 on a noncontact IC medium substrate 17, and then they are filled with a sealing resin 20 and are fixed. In this case, a plurality of small bumps are stacked in sequence to form a stud bump 13, and as they are stacked, the cross sections thereof are made larger in sequence, making the stud bump 13 like a mushroom as a whole. Thus, the sealing resin 20 is penetrated into the stud bump 13 like a wedge, attaining the purpose. <P>COPYRIGHT: (C)2008,JPO&INPIT |
