| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive tape cutting method capable of improving accuracy of cutting a supporting adhesive tape used for sticking and holding a semiconductor wafer of a ring frame, and to provide an adhesive tape sticking apparatus employing the same. <P>SOLUTION: A strip-like supporting adhesive tape is stuck on the ring frame, a cutter blade 42 having a flat surface 59 having a tip cut into a wedge is pierced through the supporting adhesive tape, and the flat surface 59 is cut along the shape of the ring frame while allowing it to contact the tape sticking surface of the ring frame. After cutting, the strip-like supporting adhesive tape cut is peeled. A wafer is placed and held on the center of the ring frame having the supporting adhesive tape stuck thereon, and a sticking roller is rotated from the rear surface to fabricate a mount frame. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
