| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for mounting a substrate to a dicing frame which is capable of mounting the substrate to the dicing frame with excellent adhesion without leaving scratch marks on a pattern and without generating wrinkles and air bubbles on the surface material even if the substrate is thin or its surface is large in unevenness. SOLUTION: This device for mounting a substrate to a dicing frame comprises a vacuum chamber 18 which is freely openable and closable, and the inside of which is brought to a reduced pressure atmosphere when the substrate is mounted; a substrate mounting table 26 which supports the outer periphery of the substrate and has at least one of support members 28 for preventing flexure around the center of the substrate; a frame fixing base 24 on which a dicing frame is placed and fixed with the adhesive surface of a dicing tape facing downwards, and at a certain distance from a substrate mounted to the substrate mounting table; and an adhering roller 38 which presses a dicing tape against the substrate by a small force, and makes the dicing tape at least preliminarily adhere to the rear surface of the substrate wherein after the dicing tape preliminarily adhered to the substrate in the reduced pressure atmosphere, the substrate is mounted to the dicing frame while the reduced pressure atmosphere is returned to an air atmosphere. COPYRIGHT: (C)2008,JPO&INPIT |
