| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a pattern which is polyimide under heat treatment at ≤300°C and has good chemical resistance after the heat treatment. <P>SOLUTION: A photosensitive resin composition is provided comprising (A) 100 parts by mass of a polycondensation product having a structure obtained by dehydration condensation of one or more tetracarboxylic acid dianhydrides and one or more aromatic diamines having an amino group and a phenolic hydroxyl group in positions which are ortho with respect to each other, (B) 1-100 parts by mass of a photosensitive diazonaphthoquinone compound, (C) 100-1,000 parts by mass of a diluent solvent and (D) 0.1-10 parts by mass of an auxiliary adhesive which is an alkoxysilyl group-containing organic compound. <P>COPYRIGHT: (C)2008,JPO&INPIT |
