| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive radiation-sensitive resin composition which excels in sensitivity, resolution and adhesion to a substrate, produces no residue at an opening after development, can suppress cracking of a resin film after plating and penetration into the resin film by plating, ensures a small dimensional change of a pattern due to a change in exposure energy, and can eliminate a T-top, a transfer film, and a production method by which thick a thick plated formed product such as a bump and wiring can be accurately formed. <P>SOLUTION: The positive radiation-sensitive resin composition comprises (A) a polymer having a structural unit having an acid-dissociating functional group which dissociates under an acid to produce an acidic functional group, a structural unit having a carboxyl group, and a crosslinked structure, (B) a radiation-sensitive acid generator and (C) an organic solvent, wherein the structural unit having the acid-dissociating functional group occupies 1-35 mol% relative to 100 mol%, in total, of all structural units constituting the polymer (A) except a structural unit containing the crosslinked structure. <P>COPYRIGHT: (C)2008,JPO&INPIT |
