| 摘要 |
PROBLEM TO BE SOLVED: To provide a method, tool, and apparatus for manufacturing a semiconductor device capable of easily heating a semiconductor substrate in a vacuum without contaminating the semiconductor substrate or a manufacturing line by metal. SOLUTION: A WBG substrate 1 is disposed on a susceptor 2a in such a manner that its principal surface 11 faces and is in contact with the susceptor 2a. On another principal surface 12 of the WBG substrate 1, a heavy-weight stone 3 is disposed. Due to the gravity applied to the heavy-weight stone 3, the WBG substrate 1 is pushed onto the susceptor 2a of a heating element. Thus, the contact area increases between the WBG substrate 1 and the susceptor 2a, and heat transmission is sufficiently performed from the susceptor 2a to the WBG substrate 1. COPYRIGHT: (C)2008,JPO&INPIT |
