| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC chip which can be mounted on a plurality of types of package, and to provide a semiconductor device packaging that IC chip. SOLUTION: The IC chip comprises an amplifying circuit 20, a first pad electrode 21 connected with the output of the amplifying circuit 20, a feedback circuit provided with a feedback resistor 23 having resistance R1 and connecting the first pad electrode 21 with the input of the amplifying circuit 20, a resistor 27 provided between the first pad electrode 21 and the feedback resistor 23, and a second pad electrode 22 provided between the resistor 27 and the feedback resistor 23. When packaging with QFP structure, a lead terminal on the package side and the first pad electrode 21 are connected by a bonding wire. When packaging with CSP structure, output terminal of the package, i.e. a solder ball 103, is connected with the first pad electrode 21 by first rewiring 101 and the solder ball 103 is connected with the second pad electrode 22 by second rewiring 102. COPYRIGHT: (C)2008,JPO&INPIT
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