| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer adhesive film including a combination of thermoplastic rubber and thermosetting resin, and particularly used as a dicing die bonding film in a semiconductor package. <P>SOLUTION: This dicing die bonding adhesive film for disposition between a semiconductor silicon wafer and a dicing support tape comprises, layer-1 adhesive to be contacted with the dicing tape, and layer-2 adhesive to be contacted with the silicon semiconductor wafer, in which the adhesion force of the layer-2 to the silicon wafer is higher than that of the layer-1 to the dicing tape by at least 0.1 N/cm, and the exposure of this film to UV irradiation is not required for peeling-off the film from the dicing support tape. <P>COPYRIGHT: (C)2008,JPO&INPIT |
