发明名称 LAMINATING/MOLDING APPARATUS CONTROL METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laminating/molding apparatus control method having extremely simple operability and for improving production efficiency. SOLUTION: The laminating/molding apparatus control method is used for controlling a laminating/molding apparatus 1 provided with: a laminator 2 for heating and pressurizing a material 14 to be laminated and a laminating material 15 to laminate/mold the laminating material 15 on the surface of the material 14 to be laminated; hot plates 9, 10 oppositely provided each other so as to come close to/separate from each other; and a press 3 for heating a laminate 16 laminated by the laminator 2 between the hot plates 9, 10, and further binding and secondary-processing the same, the binding time in either the laminator 2 or the press 3 is controlled by a timer A with a value based on the time setting for prescribing the binding completion time in the other of the laminator 2 or the press 3 as a set value. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008055464(A) 申请公布日期 2008.03.13
申请号 JP20060234959 申请日期 2006.08.31
申请人 MEIKI CO LTD 发明人 SHIRAI HIDEAKI;KOBAYASHI YOSHIAKI
分类号 B30B15/34;B29C43/02;B29C43/58 主分类号 B30B15/34
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