| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device that not only meets the strength requirements but also achieves high volume production. SOLUTION: The resin sealed semiconductor device includes a semiconductor element, a plurality of terminal materials that not only enclose a semiconductor element but also are provided with external terminals and internal terminals as well as connectors, and bonding wires connecting the semiconductor element with the internal terminals. Further, the device has support bars electrically insulated from the semiconductor element as well as the terminal materials, and sealing resins to seal the semiconductor element, terminal materials, support bars and bonding wires. Each of the terminal materials comprises thin and thick terminals. In addition to backsides of the internal terminals, surfaces and backsides as well as outside faces of the external terminals are exposed to the outside of the sealing resins. COPYRIGHT: (C)2008,JPO&INPIT
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