发明名称 ELECTRONIC COMPONENT PRESSURE BONDER AND PRESSURE BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To accurately and quickly position a tape to be drawn out on a board, and to improve the availability of an electronic component pressure bonder. SOLUTION: The electronic component pressure bonder comprises a board stage 51 for supporting a board 60, a tape feeder 20 for feeding a tape 1 composed of a peel paper 2 and an adhesive film 3, a presser 55 for pressure bonding the adhesive film 3 of the tape 1 to the board 60 by pressing the tape 1 thereonto, and a tape winder 30 for taking up the residual peel paper 2 after pressure bonding the adhesive film 3. A drawer unit 5 is disposed downstream from the tape feeder 20 for gripping and moving the peel paper 2 of the tape 1 from upstream to downstream to feed the tape 1 by a specified length onto the board 60. A hold mechanism is disposed between the tape feeder 20 and the tape winder 30 for holding the tape 1 to regulate at least its lateral motion when the drawer unit 5 grips and moves the tape 1 from upstream to downstream. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008060257(A) 申请公布日期 2008.03.13
申请号 JP20060234067 申请日期 2006.08.30
申请人 SHIBAURA MECHATRONICS CORP 发明人 SAKATA SHIGERU
分类号 H01L21/60 主分类号 H01L21/60
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