发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device having two-row pad arrangement with a specified pad arrangement and the reference of array, which permit the realization of sufficient electric characteristic and the designing of a package at a low cost. <P>SOLUTION: Power supply pads and ground pads are provided so that the ratio of total sum of the number of power supply pads and the number of ground pads to the total sum of the number of the power supply pads, and the ground pads and signal pads becomes a predetermined value or materially not less than 40%. Further, the power supply pads and the ground pads are provided so that the total sum of the number of power supply pads for a data output system, and the number of ground pads for the data output system becomes not less than 15% of the number of the entire pads. Furthermore, at least a pair of power supply pads and ground pads are arranged at the intermediate part of command/address system pads of pad array line, so that the pads of the same kind are arrayed horizontally while the power supply pad and the ground pad are arranged so as to be opposed at a position whereat the intermediate part and the end part on the same pad arrayed line part are opposed. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008060215(A) 申请公布日期 2008.03.13
申请号 JP20060233437 申请日期 2006.08.30
申请人 ELPIDA MEMORY INC 发明人 ITAYA SATORU;KATAGIRI MITSUAKI;ISA SATOSHI;UCHIDA KATSUNORI;OOISHI TSURATOKI
分类号 H01L21/822;H01L21/3205;H01L21/60;H01L21/82;H01L23/52;H01L27/04 主分类号 H01L21/822
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