发明名称 Semiconductor memory device and method for forming the same
摘要 A semiconductor memory device and a method for forming the same. The method includes forming an insulating layer on a semiconductor substrate having a conductive region, forming a contact hole that exposes the conductive region by etching the insulating layer, forming a barrier metal layer that covers a sidewall and a bottom of the contact hole, and forming a contact plug in the contact hole by interposing the barrier metal layer therebetween. An etching process may be preformed that recesses the barrier metal layer and the contact plug in such a manner that a top surface of the contact plug protrudes upward beyond a top surface of the barrier metal layer. A capping plug may be formed covering the recessed barrier metal layer and the recessed contact plug. A capacitor may be formed on the capping plug.
申请公布号 US2008061334(A1) 申请公布日期 2008.03.13
申请号 US20070896952 申请日期 2007.09.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG JU-YOUNG;JOO SUK-HO;PARK JUNG-HOON;JOO HEUNG-JIN;KIM HEE-SAN;KANG SEUNG-KUK;CHOI DO-YEON
分类号 H01L29/94;H01L21/02 主分类号 H01L29/94
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