| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC tag packaging an interposer or a rewritable sheet with an IC tag which has a structure capable of preventing IC chip from bracking due to static pressure, or the like. <P>SOLUTION: In the IC tag 1 having the interposer protecting structure, an inlet 20 packaging the interposer 30 is stuck between front and rear base materials 4, 5 for holding the inlet 20 between them by double-sided adhesive tapes 6, 7, the double-sided adhesive tape 6 on the interposer side of the inlet 20 is a cushioned center layer base material, a mass part for storing the interposer 30 is compressed, the interposer 30 is stored in the compression part 8, and the cushioned double-sided adhesive tape 6 is stuck to the inlet 20. The rewritable sheet with the IC tag has the IC tag 1, on a part of the sheet and a recording area composed of a reversible heat sensitive recording material, is formed on the surface of the front base material. <P>COPYRIGHT: (C)2008,JPO&INPIT |
