| 摘要 |
PROBLEM TO BE SOLVED: To provide a vehicle AC generator where stress of a semiconductor pellet used for a rectifier element can be reduced irrespective of hardness of a heat dissipation plate and a disk of the rectifier element. SOLUTION: A rectifying device comprising a plurality of rectifier elements 55 and the heat dissipation plate 53 is incorporated in the vehicle AC generator. The heat dissipation plate 53 has placing openings to which the rectifier elements 55 are press-fitted. The rectifier element 55 comprises the semiconductor pellet 510 and the disk 500 to which the semiconductor pellet 510 is soldered to an inner base of a concave part. A bonding face 506 of the disk 500 to which the semiconductor pellet 510 is soldered is set in a thickness range of the heat dissipation plate 53. A press-fitting range of the disk 500 to the heat dissipation plate 53 is set in a range from a base of the disk 500 to the bonding face 506 to which the semiconductor pellet 510 is soldered. COPYRIGHT: (C)2008,JPO&INPIT |
