发明名称 METHOD OF FABRICATING EMBEDDED FLASH MEMORY DEVICE
摘要 <p>A method for manufacturing an embedded flash memory device is provided to enhance the reliability of the embedded flash memory device by preventing deterioration of logic conformity in a logic region. A first region and a second region are defined on a semiconductor substrate(110). A floating gate structure is formed to interpose a first gate insulating layer pattern(114a) into the first region. A second gate insulating layer(125) is formed on the semiconductor substrate of the first region and the second region including the floating gate structure. A well is formed within the semiconductor substrate of the second region including the second gate insulating layer. The first and the second region correspond to a flash memory cell region and a logic region. The logic region includes a low voltage region and a high voltage region. The second gate insulating layer of the high voltage region is thicker than a first gate insulating layer pattern.</p>
申请公布号 KR100812237(B1) 申请公布日期 2008.03.10
申请号 KR20060081082 申请日期 2006.08.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 MOON, JUNG HO;KWON, CHUL SOON;YU, JAE MIN;JEONG, YOUNG CHEON;YOON, IN GU;LIM, BYEONG CHEOL
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
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