Micro-mechanical component for use as e.g. microphone, has hollow space formed between diaphragm area and carrier substrate, and diaphragm structure with inversion that extends into complementary recess in carrier substrate

摘要

The component has a layer structure and a diaphragm structure formed in the layer structure. The diaphragm structure has a diaphragm area (9) formed parallel to a carrier substrate (1). A hollow space (10) is formed between the diaphragm area and the carrier substrate. The diaphragm structure has an inversion (8) that extends into a complementary recess (2) in the carrier substrate. A lower end of the inversion has a level body that is designed parallel to a layer plane of the layer structure. An independent claim is also included for a method for manufacturing a micro-mechanical component.