| 摘要 |
A technique for forming a film of material ( 12 ) from a donor substrate ( 10 ). The technique has a step of forming a stressed region in a selected manner at a selected depth ( 20 ) underneath the surface. An energy source such as pressurized fluid is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate ( 10 ) at the selected depth ( 20 ), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.
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