METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a printed circuit board is provided to prevent a printing error by dualizing a curing process for a wiring unit and a pad. A method for manufacturing a printed circuit board includes the steps of: forming a pad pattern corresponding to a pad unit by discharging a conductive ink on a surface of a substrate(S10); temporarily curing the pad pattern(S20); forming a wiring pattern corresponding to a wiring unit by discharging the conductive ink on the surface of the substrate(S30); and completely curing the pad pattern and the wiring pattern(S40), wherein the conductive ink includes a light curing material, and the ultraviolet rays with predetermined energy is irradiated to the pad pattern in a temporarily curing step.