| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device with a fuse. SOLUTION: The semiconductor device is composed of an electric-fusion relief fuse 4a and a testing fuse 4b provided on a layer M4 of layers M1-M6 forming a multilayer wiring on a main surface of a semiconductor substrate 11, a pair of conductor plates 10a provided on the layers M2, M6 near the fuse 4a, and a pair of conductor plates 10b provided on the layers M3, M5 near the fuse 4b. The distance between the fuse 4b and the plate 10b is shorter than that between the fuse 4a and the plate 10a. COPYRIGHT: (C)2008,JPO&INPIT
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