发明名称 |
A MEMS PACKAGE USING FLEXIBLE SUBSTRATES, AND METHOD THEREOF |
摘要 |
A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device (40) located on a flexible substrate (10). A metal structure (54, 56) surrounds the at least one MEMS device (40) wherein a bottom surface of the metal structure (54, 56) is attached to the flexible substrate (10) and wherein a portion of the flexible substrate (10) is folded over a top surface of the metal structure (54, 56) and attached to the top surface of the metal structure thereby forming the MEMS package. |
申请公布号 |
WO2007010361(A8) |
申请公布日期 |
2008.03.06 |
申请号 |
WO2006IB01966 |
申请日期 |
2006.07.17 |
申请人 |
SILICON MATRIX PTE. LTD.;WANG, ZHE;MIAO, YUBO |
发明人 |
WANG, ZHE;MIAO, YUBO |
分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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