发明名称 APPARATUS FOR PREVENTING PRINTED CIRCUIT BOARD WARPAGE
摘要 PROBLEM TO BE SOLVED: To solve the problem that a conventional apparatus for preventing a printed wiring board warpage is not capable of preventing the warpage during the time from just before going out of an automatic soldering apparatus until going to the next process apparatus. SOLUTION: The apparatus includes a part to be inserted in an automatic soldering apparatus, a mechanism of straightly arranged non-driving thin rollers, a mechanism for adjusting the roller height, a mechanism for adjusting the height positions of both end rollers of the roller line, and an opening at a roller holder. This prevents the warpage of the printed wiring board during the time from just before going out of an automatic soldering apparatus until going to the next process apparatus. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008053329(A) 申请公布日期 2008.03.06
申请号 JP20060226102 申请日期 2006.08.23
申请人 UNEGAWA KOGYO KK 发明人 UNEGAWA NORIHIRO
分类号 H05K3/22 主分类号 H05K3/22
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