SEMICONDUCTOR DIE PACKAGE AND EMBEDDED PRINTED CIRCUIT BOARD

摘要

A semiconductor die package and an embedded printed circuit board using the same are provided to easily emit the heat from the semiconductor die by attaching a heat release pad on the semiconductor die. A circuit pattern(112) is formed on a semiconductor die(110). A bump pad(121) has at least one bump(122) connected to the circuit pattern. A heat release pad(130) enclosing the circumferences of the bumps is formed on the bump pad. A through-hole passing through an upper surface and a lower surface is formed on a core substrate. The semiconductor die is received on an upper surface of the core substrate so that the bumps pass through the through-hole. Insulating substrates are formed on an upper portion and a lower portion of the core substrate centering around the core substrate. Conductive pattern layers are disposed between the core substrate and the insulating substrates.